AMD Launches Ultra-Low-Power Ryzen Embedded APUs: Starting at 6W
by Anton Shilov on February 27, 2020 12:00 PM EST
While it doesn't get the same attention as their high-profile mobile, desktop, or server CPU offerings, AMD's embedded division is an important fourth platform for the chipmaker. To that end, this week the company is revealing its lowest-power Ryzen processors ever, with a new series of embedded chips that are designed for use in ultra-compact commercial and industrial systems.
The chips in question are the AMD Ryzen Embedded R1102G and the AMD Ryzen Embedded R1305G SoCs. These parts feature a 6 W or a configurable 8 W - 10 W TDP, respectively. Both SoCs feature two Zen cores with or without simultaneous multithreading, AMD Radeon Vega 3 graphics, 1 MB L2 cache, 4 MB L3 cache, a single channel or a dual-channel memory controller, and two 10 GbE ports.
| AMD Ryzen Embedded R1000-Series APUs | |||||||||
| AnandTech | Cores Threads |
Base Freq |
Turbo Freq |
L2 | L3 | GPU SPs |
IGP Freq |
DRAM | TDP |
| Ryzen Embedded R1606G | 2C / 4T | 2600 | 3500 | 1MB | 4MB | 192 | 1200 | Dual Channel with ECC |
12W - 25W |
| Ryzen Embedded R1505G | 2C / 4T | 2400 | 3300 | 1MB | 4MB | 192 | 1000 | Dual Channel with ECC |
12W - 25W |
| Ryzen Embedded R1305G | 2C / 4T | 1500 | 2800 | 1MB | 4MB | 192 | 1000 | Dual Channel | 8W - 10W |
| Ryzen Embedded R1102G | 2C / 2T | 1200 | 2600 | 1MB | 4MB | 192 | 1000 | Single Channel with ECC | 6W |
AMD says that a low TDP and reduced number of supported DIMMs (in case of the R1102G) enable system makers to simplify their designs and make them cheaper as compared to machines that run AMD's higher performing and higher TDP Ryzen Embedded processors.
AMD’s first customers to use the Ryzen Embedded R1102G and the Ryzen Embedded R1305G SoCs will be Kontron, which has a scalable D3713-V/R Mini-ITX platform, and Simply NUC, which has its Red Oak miniature PC. Other makers may get a 4x4 motherboard from Sapphire based on AMD's new Ryzen Embedded R1000-series APUs.
Both ultra-low-power AMD Ryzen Embedded APUs will be available for the next 10 years, meaning availability will stretch all the way till 2030.
Related Reading:
- Sapphire Announces Two 4x4 AMD Ryzen Embedded Motherboards
- Ryzen UCFF-palooza: Multiple PC Makers Now Shipping AMD Ryzen Embedded Systems
- SimplyNUC Unveils Sequoia: AMD Ryzen V-Series-Based UCFF PC
- Sapphire Unveils FS-FP5V: AMD Ryzen Embedded Mini-STX Motherboard
Source: AMD
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Operandi - Thursday, February 27, 2020 - link
Didn't even know that existed, thanks.Also, this type of information should be in the original article.
Santoval - Thursday, February 27, 2020 - link
At first i thought Shaggi was jesting so I looked it up and no, Dali actually exists. It's also the very first time I hear of it.neblogai - Friday, February 28, 2020 - link
It is a variation of Raven2/Banded Kestrel die. Same 14nm, but maybe a different revision of it.Kaggy - Friday, February 28, 2020 - link
Would be nice if they made a product similar to Intel Compute StickHStewart - Friday, February 28, 2020 - link
I am not sure the packaging is smaller enough for handling of that kind of form factor, if you look at the Kontron images in the link in article, the size of the chip appears to be the same size of computer stick. Plus you need additional components like Ram and other circuitrythomasg - Saturday, February 29, 2020 - link
It's of course not nearly as large as the Intel Compute Stick.AMD appears to use their FP5 package, with is 25 x 35 mm
The Atom Compute Sticks use a 17 x 17 mm package.
Intels "Core m5" Compute Sticks use a 16.5 x 20 mm package.
So the Ryzen Embedded uses up to 3 times the space.
The reason for this is all the extra contacts needed for features Intel doesn't have.
The following comparison is against the m5 as used in the Compute Stick, not the Atom, which has significantly fewer features:
ECC support requires 16 additional contacts
8 PCIe lanes instead of 4 is another 8 extra contacts
2 (3) displays instead of 1 (no extra contacts, but larger display engine)
More USB ports (Intel doesn't mention the actual number)
2 x SATA interface (Intel has none), 8 extra contacts
Many more interfaces: GPIOs, UARTs, ...
AMD offers only 1 package (FP5), so the lower end Embedded Ryzens use fewer contacts and could in theory be made smaller, probably in a similar sized package than the Core m5.
thomasg - Saturday, February 29, 2020 - link
To make it clear: The Compute Stick is about 5 times as large as the Ryzen FP5 package (38*114 mm vs. 25*35 mm).myself248 - Friday, February 28, 2020 - link
Any chance these might someday be available in a Socket AM4 package? I'd love to build low-power desktops around these, as long as I had the option to upgrade the chip later as my needs change.mode_13h - Saturday, February 29, 2020 - link
If you want an AM4 socketed version, just use a Ryzen 3 2200G and underclock it. It's basically the same thing.You'll need the Pro version, if you want ECC memory. You can find those (used) on ebay, since AMD only sells them to OEMs.
mode_13h - Saturday, February 29, 2020 - link
Also, many boards' BIOS will let you disable cores.