SoIC

Currently the majority of high-end processors are monolithic, but design methodologies are slowly but surely shifting to multi-chiplet modules as leading-edge fabrication technologies get more expensive to use. In the coming years multi-chiplet system-in-packages (SiPs) are expected to become much more widespread, and advanced 2.5D and 3D chip packaging technologies will gain importance. To accelerate and simplify development of 3D designs, TSMC this week established its 3DFabric Alliance. While multi-chiplet SiPs promise to simplify development and verification of highly complex designs, they require brand-new development methodologies as 3D packages bring a number of new challenges. This includes new design flows required for 3D integration, new methods of power delivery, new packaging technologies, and new testing techniques. To make the best use of the benefits of...