ASML

In the past week, TSMC ran its 2021 Technology Symposium, covering its latest developments in process node technology designed to improve the performance, costs, and capabilities for its customers. In this event, TSMC discussed its increasing use of Extreme Ultra Violet (EUV) lithography for manufacturing, enabling it to scale down to its 3nm process node, well beyond that of its competitors. TSMC also addressed the current issues surrounding demand for semiconductors, along with announcing that it is building new facilities for advanced packaging production. Joining CEO Dr. CC Wei as part of the keynote presentation was AMD’s CEO Dr. Lisa Su, Qualcomm’s President (and soon to be CEO) Cristiano Amon, and Ambiq’s Founder and CTO Scott Hanson. As part of the proceedings, TSMC offered AnandTech...

EUV Pellicles Ready For Fabs, Expected to Boost Chip Yields and Sizes

Foundries started limited usage of extreme ultraviolet (EUV) lithography for high-volume manufacturing (HVM) of chips in 2019. At the time, ASML's Twinscan NXE scanners were good enough for production...

35 by Anton Shilov on 3/31/2021

TSMC: We have 50% of All EUV Installations, 60% Wafer Capacity

One of the overriding central messages to TSMC’s Technology Symposium this week is that the company is a world leader in semiconductor manufacturing, especially at the leading edge process...

32 by Dr. Ian Cutress on 8/27/2020

ASML’s First Multi-Beam Inspection Tool for 5nm

ASML has announced it has made a significant development in its multi-beam inspectional tool line. The new eScan1000 moves a single beam scanning process into a nine-beam scanning process...

19 by Dr. Ian Cutress on 6/1/2020

ASML Ramps Up EUV Scanners Production: 35 in 2020, Up to 50 in 2021

ASML shipped 26 extreme ultraviolet lithography (EUVL) step-and-scan systems to its customers last year, and the company plans to increase shipments to around 35 in 2020. And the ramp-up...

22 by Anton Shilov on 1/23/2020

EUV Wafers Processed and TwinScan Machine Uptime: A Quick Look

One of the interesting elements that came out of some of our discussions at the IEDM conference this year revolve around the present deployment of EUV. Currently only one...

29 by Dr. Ian Cutress on 12/11/2019

EUV Demand is Up: EUV Device Manufacturer ASML Beats Sales Estimates

Between the smartphone revolution, cloud computing, and the Internet of Things, the demand for cutting-edge chips has never been higher. And if you have any doubts about that, then...

46 by Anton Shilov on 10/16/2019

ASML to Ship 30 EUV Scanners in 2019: Faster EUV Tools Coming

ASML said last week that it planned to ship 30 extreme ultraviolet scanners in 2019, up significantly from 2018. The plan is not surprising, as demand for EUV lithography...

17 by Anton Shilov on 1/28/2019

ASML, Carl Zeiss, and Nikon to Settle Legal Disputes Over Immersion Lithography

Embroiled for some time now in legal disputes concerning immersion lithography, ASML, Carl Zeiss, and Nikon, this week signed a memorandum of understanding relating to a plan to once...

10 by Anton Shilov on 1/25/2019

ASML Ships Twinscan NXT:2000i Scanner for 7nm and 5nm DUV

ASML, the company known for producing equipment for the manufacture of processors and semiconductors at foundries, has started to ship its new Twinscan NXT:2000i DUV (Deep Ultra Violet) scanner...

15 by Anton Shilov on 8/2/2018

The Future of Silicon: An Exclusive Interview with Dr. Gary Patton, CTO of GlobalFoundries

In our recent trip to GlobalFoundries Fab 8, its leading edge facility, we managed to spend some time with the C-level executive that controls the future of this part...

39 by Ian Cutress on 2/24/2018

The AnandTech Podcast, Episode 45: GlobalFoundries and Fab 8

In early February, GlobalFoundries did something completely unexpected: for the second time in ten years, they invited a few select press and analysts to visit one of their fabrication...

14 by Ian Cutress on 2/20/2018

EUV Lithography Makes Good Progress, Still Not Ready for Prime Time

At the recent annual SPIE Advanced Lithography conference, Intel, TSMC and other leading semiconductor companies said that significant strides have been made in extreme ultraviolet lithography (EUVL) over the...

38 by Anton Shilov on 3/10/2016

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