Memory
Samsung today has announced that they have developed an even faster generation of LPDDR5X memory that is set to top out at LPDDR5X-10700 speeds. The updated memory is slated to offer 25% better performance and 30% greater capacity compared to existing mobile DRAM devices from the company. The new chips also appear to be tangibly faster than Micron's LPDDR5X memory and SK hynix's LPDDR5T chips. Samsung's forthcoming LPDDR5X devices feature a data transfer rate of 10.7 GT/s as well as maximum capacity per stack of 32 GB. This allows Samsung's clients to equip their latest smartphones or laptops with 32 GB of low-power memory using just one DRAM package, which greatly simplifies their designs. Samsung says that 32 GB of memory will be particularly beneficial...
Memory Scaling on Ryzen 7 with Team Group's Night Hawk RGB
A large number of column inches have been put towards describing and explaining AMD's new underlying scalable interconnect: the Infinity Fabric. A superset of HyperTransport, this interconnect is designed...
65 by Ian Cutress & Gavin Bonshor on 9/27/2017
GSkill Announces New AMD Compatible Trident Z RGB Kits
With both AMD Ryzen and Threadripper platforms continuing to mature, we’ve seen an increase in the two platform’s ability to handle higher capacity and faster RAM and be stable...
13 by Joe Shields on 9/22/2017
Corsair Announces 16GB DDR4-4600 Vengeance LPX DRAM Kits
Corsair on Thursday announced two fresh Vengeance LPX memory kits that set new performance records for the product family. The new dual-channel memory kits are intended for Intel’s Kaby...
16 by Anton Shilov on 9/15/2017
G.Skill Ups the Ante on Memory Speed and Voltage: 16 GB DDR4-4600 1.5v Kit for Kaby Lake-X
G.Skill on Friday introduced its fastest dual-channel memory kit designed specifically for Intel’s Kaby Lake-X processors and Intel’s X299 HEDT platforms. The new Trident Z DDR4-4600 DIMMs not only...
14 by Anton Shilov on 9/8/2017
Longsys Acquires Lexar Brand from Micron
Longsys on Thursday announced that it has acquired the Lexar brand name from Micron. The China-based supplier of NAND flash memory-based products will use the trademark to sell Lexar’s...
5 by Anton Shilov on 9/1/2017
Samsung & SK Hynix Graphics Memory Prices Increase Over 30% In August
In the midst of a global DRAM shortage, Digitimes reports that the market prices for graphics memory from Samsung and SK Hynix have increased by over 30% for August...
55 by Nate Oh on 8/16/2017
Geil Announces EVO Spear Series DRAM: Up to DDR4-3466
Geil recently announced the availability of its new EVO Spear series of memory, with kits labeled specifically for either Intel and AMD Ryzen based systems. Geil states the EVO...
6 by Joe Shields on 8/15/2017
G.Skill Unwraps Flare X 32 GB and 128 GB DDR4 Kits for AMD Threadripper: Up to 3600 MT/s
G.Skill has announced its lineup of DDR4 memory kits compatible with AMD’s new Ryzen Threadripper CPUs. The Flare X quad-channel kits are offered in 32 GB and 128 GB...
24 by Anton Shilov on 8/11/2017
SK Hynix: Customers Willing to Pay 2.5 Times More for HBM2 Memory
SK Hynix was the first DRAM manufacturer to start producing HBM Gen 1 memory in high volume back in 2015. However, the company is somewhat behind its rival Samsung...
23 by Anton Shilov on 8/4/2017
EagleTree and Partners Acquire Majority Stake in Corsair for $525 Million
EagleTree Capital, the Investment Management Corp. of Ontario (IMCO), and the Honeywell pension fund on Wednesday announced that they had reached an agreement to acquire a majority stake in...
7 by Anton Shilov on 7/27/2017
Samsung Increases Production Volumes of 8 GB HBM2 Chips Due to Growing Demand
Samsung on Tuesday announced that it is increasing production volumes of its 8 GB, 8-Hi HBM2 DRAM stacks due to growing demand. In the coming months the company’s 8...
34 by Anton Shilov on 7/19/2017
Toshiba Weds 3D NAND and TSV: Up to 1 TB 3D TLC Chips with 1066 MT/s I/O Incoming
Toshiba on Wednesday introduced its first BiCS 3D TLC NAND flash chips with 512 GB and 1 TB capacities. . The new ICs stack 8 or 16 3D NAND...
6 by Anton Shilov on 7/14/2017
Patriot Publishes List of AMD Ryzen Compatible DIMMs: Up to DDR4-3400, 64 GB
Patriot has published a list of its memory modules that are verified and compatible with AMD Ryzen processors. This includes the Viper 4 and Viper Elite modules that are...
3 by Anton Shilov & Joe Shields on 7/13/2017
Samsung’s Multi-Billion Fab in Pyeongtaek Starts Production of 64-Layer V-NAND
Samsung on Tuesday announced that it had started mass production of 64-layer V-NAND memory in its newly build fab in Pyeongtaek, South Korea, and the first batch had already...
17 by Anton Shilov on 7/6/2017
Toshiba's 768Gb 3D QLC NAND Flash Memory: Matching TLC at 1000 P/E Cycles?
Toshiba last week announced its first 3D NAND flash memory chips featuring QLC (quadruple level cell) BiCS architecture. The new components feature 64 layers and developers of SSDs and...
37 by Anton Shilov on 7/3/2017
G.Skill Announces Quad-Channel DDR4-4200 Kit for Intel Skylake-X CPUs
G.Skill this past week has formally announced its quad-channel memory kits designed for the latest Intel Core i7 (Skylake-X) CPUs and the Intel X299 platform. The flagship 64 GB...
11 by Anton Shilov on 6/29/2017
Micron Discontinues Lexar Business, Plans to Focus on Higher-Margin Products
Micron this week announced plans to discontinue its Lexar removable media storage business as a part of the company’s strategy to shift to higher margin NAND flash-based products. The...
18 by Anton Shilov on 6/28/2017
Western Digital Announce BiCS4 3D NAND: 96 Layers, TLC & QLC, Up to 1 Tb per Chip
Western Digital on Tuesday formally announced its fourth-generation 3D NAND memory, developed as part of the Western Digital/Toshiba joint venture. The fourth-generation BiCS NAND flash chips from Western Digital...
22 by Anton Shilov on 6/28/2017
Micron Discusses GDDR: 16 Gbps GDDR5X, 16 nm GDDR6 and GDDR5
Micron has made a number of announcements in recent weeks regarding its GDDR memory for graphics cards, game consoles and networking applications. The company is reporting that they've been...
20 by Anton Shilov on 6/18/2017
DRAM and Motherboard Makers Demonstrate Quad-Channel DDR4-4000+ Operation
Over the course of Computex, manufacturers of memory modules and motherboards alike took to the show to showcase the latest developments in high-speed quad-channel memory configurations. Powered by Intel’s...
16 by Anton Shilov on 6/9/2017
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